XMSIG directly invests, takes the lead or participates in corporate equity financing and mergers and acquisitions.
Relying on professional semiconductor fund management companies, the focus is on non-manufacturing projects in the IC industry.
Focus on supporting excellent chip design team
Industrial layout around product-oriented technology
Focusing on the layout of the advanced packaging industry chain, it will support the demand for downstream and carrier capacity after the expansion of China's large-scale production capacity.
Focus on meeting the needs of miniaturization, low power consumption and low cost. Terminal applications such as 5G, consumer, IOT, MEMS sensors, automotive, industrial and other markets driven by new business models.
Focus on the domestic industry chain of wafer manufacturing
IC design company dedicated to communication chips for Internet of things, focusing on radio frequency SoC chips and solutions
The company is committed to building a domestic and international first-class package design and system-level package service platform.